In medical equipment, many different gas flows need to be controlled, including gases such as O2, CO2, He, Xe, Kr, Ar, Ne, N2, N2O, and H2, all in varying concentrations ranging from 0 – 80%. Traces of up to 500 ppm of NO, CO, and H2S could occur in the gas mixture and should be detected. Some applications may require the use of gaseous anaesthetic agents such as isoflurane and desflurane. This also imposes demands on the chemical compatibility of the materials used.
In multi-infusion systems, the flow meters need to measure the amount of liquid pharmaceuticals as well as multiparameter measurements to measure the composition and parameters of the pharmaceuticals. Typical liquids to be administered are noradrenaline, dopamine, dobutamine, morphine, insulin, glucose and saline solution.
Whereas the flow sensors themselves are reaching the point that they can meet the required performance, an essential final problem still needs to be resolved. Namely, the connection of the flow sensor chip to the outside world without elastomer seal or glue, since these wetted materials can pose unacceptable risks in these applications. In breathing systems, elastomers can release volatile substances (VOCs) in the breathing gas path that the patient inhales directly. With multi-infusion systems, unwanted interactions between the glue and the different medications can occur, causing the glue to dissolve or the medication to become ineffective. This issue limits the application of microfluidics in the aforementioned demanding fields. This project aims to find methods to eliminate these urgent packaging issues. As the demand for advanced ventilators and multi-infusion systems grows, finding a suitable “glueless” sealing method will become a key solution in bringing MEMS based microfluidic flow meters to the medical and other markets, driving further innovation in healthcare and related technologies.
The goal of this project is to find a reliable packaging technique for silicon chips with embedded microfluidic channels that does not involve the use of glue or elastomer seals. The project will focus on microfluidic channels with a channel wall of low-stress silicon-rich silicon nitride. The proposed research aims to study the fundamentals of bonding glass or metals to silicon nitride coated silicon wafers as well as accessing the feasibility of using these bonding methods for MEMS-based microfluidic sensor packaging.
The targeted output of the project is a glueless sealing technique which allows to hermetically seal the fluidic channels of a MEMS-based microfluidic sensor to a fluidic adaptor. The seal shall be able to withstand pressures up to 30 bar at a temperature range between -20°C and 70°C. To extend the applicability of the microfluidic sensor, only inert materials for the seal and the adaptor will be considered.
The main challenges are (1) exploring the most promising bonding techniques that should be investigated, (2) carry out bonding experiments and analyse the results (3) design, fabrication and packaging of actual sensor chips in the MESA+ cleanroom and (4) evaluation of the resulting performance in our MEMS measurement lab.
The PhD candidate will work at the Integrated Devices and Systems (IDS) group within the Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) at the University of Twente in Enschede, the Netherlands. You will carry out the research at the University of Twente, with guidance from senior scientists and support from a senior engineer. Various teaching activities in your field of expertise may take up to 20% of your time.
Information and application
Are you interested in this position? Please send your application via the 'Apply now' button below before October 1, 2026, and include:
- A Curriculum Vitae, including a list of all courses attended and grades obtained, and, if applicable, a list of publications and references.
- A cover letter (maximum 2 pages A4), emphasising your specific interest, qualifications, motivations to apply for this position.
For more information regarding this position, you are welcome to contact dr. ir. R.J. Wiegerink at R.J.Wiegerink@utwente.nl.
Screening is part of the selection process.
About the department
The IDS group is part of the Faculty of Electrical Engineering, Mathematics, and Computer Science. The research group studies electronic and electromechanical components and develops new concepts for nanoscale materials, devices and systems using nano- and microfabrication techniques. One ambition of the IDS group is to combine its experience in both semiconductor and MEMS technologies to design, fabricate and characterise novel smart sensing devices.
IDS contributes to the MESA+ Institute and has a strong track records in knowledge transfers to the semiconductor industry. MESA+ is the largest research institute of the University of Twente. The institute trains graduate students and PhD-students and conducts research in the fields of nanotechnology, microsystems, materials science and microelectronics. Unique of MESA+ is its multidisciplinary composition.
About the organisation
The faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS) uses mathematics, electronics and computer technology to contribute to the development of Information and Communication Technology (ICT). With ICT present in almost every device and product we use nowadays, we embrace our role as contributors to a broad range of societal activities and as pioneers of tomorrow's digital society. As part of a tech university that aims to shape society, individuals and connections, our faculty works together intensively with industrial partners and researchers in the Netherlands and abroad, and conducts extensive research for external commissioning parties and funders. Our research has a high profile both in the Netherlands and internationally. It has been accommodated in three multidisciplinary UT research institutes: Mesa+ Institute, TechMed Centre and Digital Society Institute.
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